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Text File  |  1992-09-09  |  696 b   |  15 lines
  1. Newsgroups: sci.engr.mech
  2. Path: sparky!uunet!munnari.oz.au!hp9000.csc.cuhk.hk!uxmail!uxmail.ust.hk!eekhfung
  3. From: eekhfung@uxmail.ust.hk (Fung Ka Hing)
  4. Subject: Thermal analysis of silicon die
  5. Message-ID: <1992Sep9.084028.13576@uxmail.ust.hk>
  6. Sender: eekhfung@hkust.hk
  7. Organization: Hong Kong University of Science and Technology
  8. References: <Yeb7VDe00VpKQ67kkH@andrew.cmu.edu> <24238@oasys.dt.navy.mil> <1992Aug31.034233.143@isus.UUCP>
  9. Date: Wed, 9 Sep 1992 08:40:28 GMT
  10. Lines: 3
  11.  
  12. We have an undergoing project that needs to know the thermal distribution on
  13. the die of integrated circuit.  Can anyone help me by suggesting some reference
  14. book or some thermal analysis software for this purpose.
  15.