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- From: mdgoodma@CRDEC8.APGEA.ARMY.MIL (Mack Goodman Have Goals and Faith)
- Newsgroups: sci.electronics
- Subject: SOLDERING QUESTION -- CORROSION AND FLUX ----
- Message-ID: <9209011003.aa27943@crdec8.apgea.army.mil>
- Date: 1 Sep 92 14:03:04 GMT
- Sender: usenet@ucbvax.BERKELEY.EDU
- Lines: 41
-
-
- Need some soldering advice....
-
- I have a situation here where we are soldering a solid copper wire
- into a nickel-plated cup-pin. The pin cup is a blind hole, that is
- no outlet .
- The way we are doing it is to fill the pin cup with the correct amount of
- solder paste then install the copper wire and pass this under a
- propane flame for a specified amount of time ( depends on solder, etc)
-
- This part goes into a microphone assembly and must have continuity, ofcourse.
-
- We are using a 60/40 solder with a AC flux, however the AC flux is
- organic ( non rosin ) halide.
-
- The question is corrosion. In the past, everything ( literature ) has
- said do not use AC flux in a electronic application due to the great
- potential for corrosion, however, it appears now there are some guides
- saying it's ok to use the "organic" AC fluxes.
-
- WE are having a problem with these connections coming loose at the
- solder joint.
-
- IS corrosion to blame?
-
- How can we determine it? It seems to get worse over time but that is
- very subjective right now because we can't say if the joint was done
- properly a year ago or not. IS THERE A WAY TO CHECK THE JOINT FOR
- CORROSION??
-
- Thanks for any help you can provide.
-
- Mack
- US ARMY
- ABERDEEN PROVING GROUND.
- mdgoodma@crdec8.apgea.army.mil
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