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- From: ewstroup@cc.utah.edu (ERIC W. STROUP)
- Subject: Re: Wanted, physical constants of Si3N4
- Message-ID: <11NOV199209512202@cc.utah.edu>
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- Sender: news@fcom.cc.utah.edu
- Organization: University of Utah Computer Center
- References: <1992Nov10.210417.21065@bnr.ca>
- Date: 11 Nov 1992 09:51 MST
- Lines: 24
-
- In article <1992Nov10.210417.21065@bnr.ca>, miking@bnr.ca writes...
- {Could anyone supply me with physical constants of silicon nitride? The usual
- {standard references (Wolfe, INSPEC, CRC) don't seem to have much related to
- {this material. Thanks in advance. Mike King
-
- Silicon nitride Density Elasitc Modulus Poisson's ratio
- 3.44 304 GPa 0.24
-
- Koop Hardness Modulus of Rupture
- 2200 414-580 MPa
-
- Electrical Resistivity Thermal Conductivity
- >10^12 Ohm-meter 16-33 W/m-K
-
- Coefficient of Thermal Expansion Melting Temperature
- 3.6 (C)^-1 x10^6 ~1900 C
-
- -Eric
- ****************************************************************************
- Eric W. Stroup Department of Bioengineering
- ewstroup@cc.utah.edu 2480 MEB, University of Utah
- c-sew@math.utah.edu Salt Lake City, UT 84112
- ****************************************************************************
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