home *** CD-ROM | disk | FTP | other *** search
- Newsgroups: sci.electronics
- Path: sparky!uunet!gumby!destroyer!ubc-cs!fs1.ee.ubc.ca!walter
- From: walter@ee.ubc.ca (Walter Wohlmuth)
- Subject: Re: Current research in chip fabrication technology
- Message-ID: <1992Sep2.155758.17249@ee.ubc.ca>
- Organization: University of BC, Electrical Engineering
- References: <1992Aug20.004110.3357@unixg.ubc.ca> <2207@fnnews.fnal.gov> <1992Aug31.200556.3498@aee.aee.com>
- Date: Wed, 2 Sep 1992 15:57:58 GMT
- Lines: 76
-
- In article <1992Aug31.200556.3498@aee.aee.com> gene@aee.aee.com (Gene Kochanowsky) writes:
- >hoff@fasic5.fnal.gov (Jim Hoff) writes:
- >
- >>In article <1992Aug20.004110.3357@unixg.ubc.ca>, sankey@unixg.ubc.ca (Todd Sankey) writes:
- >>|>
- >>|> I am trying to prepare a presentation on the current state of research
- >>|> in chip fabrication. I am requesting any sort of information from
- >>|> researchers/students/engineers/anyone in the know.
- > (lines deleted)
-
- >>I'm not really sure how to approach this. I guess, in short, I'll just ask
- >>what exactly is it you want to know? No offense, but this is like saying
- >>I'm presenting a paper on trees, send me everything you know about trees.
- >>It's just a little broad. If you ask specific question, or even post a
- >>questionaire, I'll be happy to respond, if it is in my area, but, heck, I
- >>could talk your ear off probably for several days running on
- >>"chip fabrication", and most of it would be of no interest to you whatsoever.
- >
- >>If you wish, please repost with a much more specific series of questions.
- >
- >> Jim Hoff
- >Jim,
- >
- > if you wished to do this that would be great. I have long had a great
- >interest in this area. However if this seems to be too much, then a brief overview
- >would also be appreciated.
- >
- >Gene Kochanowsky
- >
- >--
- >------------------------------------------------------------------------------
- >Gene Kochanowsky | "And remember ....
- >Associated Electronic Engineers, Inc. | The better you look ...
- >2864 Cercy Trace |
-
- I think the best way to get info on this topic is to respond to a list
- of different areas currently being researched. Below I present a partial
- list of the current areas of interest in semiconductor device/fab. tech.
-
- 1. Silicon, standard typically is DRAM size and minimum resolution
- -256 MBit DRAMs are currently being made with ~0.35 um resolution
- -1 GBit DRAMs expected in the next 5 years, ~0.2 um resolution
- -X-ray lithography should enable sub 0.1 um resolution, still
- need a collimated, high intensity source
- -phase shift mask tech. theoretically able to get 0.15 um res.
-
- 2. GaAs/AlGaAs & InGaAs/InAlAs/InP, high speed electronics
- -able to create devices in 1-100 GHz range
- -high radiation tolerance, i.e.: space & nuclear appl.
- -may be possible to integrate devices together with Si devices
- -fiber optics, communications
-
- 3. GaN, InN, AlN
- -potential for UV lasers and detectors, if realized will
- revolutionize graphics and imaging systems because solid
- state red, green and blue lasers will be available.
- -secure space to space communications, signals will be absorbed
- by ozone layer if it still exists
- -probs. in layer quality, not too severe
-
- 4. BN, SiC, diamond
- -superhard materials, high radiation tolerance, low co-eff. of
- friction, i.e. lubricant not needed.
- -appl. mainly in coatings, moving into semiconductors
- -research recently declassified
- -tremendous amount of appl.
-
- I hope this list helped you guys out. There is also a lot of research
- being done in multichip module, hybrid circuits of which I am mostly
- ignorant of at this moment.
-
- --------------------------------------------------------------------------
- | Walter A. Wohlmuth walter@ee.ubc.ca |
- | Tri-University Meson Facility U of B.C., Canada |
- | Microelectronics Lab |
- --------------------------------------------------------------------------
-