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- Path: sparky!uunet!ogicse!uwm.edu!cs.utexas.edu!usc!chaph.usc.edu!news
- From: baffoni@aludra.usc.edu (Juxtaposer)
- Newsgroups: comp.sys.atari.st
- Subject: Re: New operating systems (OS/2-TOS)
- Message-ID: <la0i35INN8ol@aludra.usc.edu>
- Date: 29 Aug 92 14:02:45 GMT
- Article-I.D.: aludra.la0i35INN8ol
- References: <1992Aug26.182907.28894@ra.msstate.edu> <1992Aug26.202952.26085@nosc.mil> <4278@wet.UUCP>
- Organization: University of Southern California, Los Angeles, CA
- Lines: 26
- NNTP-Posting-Host: aludra.usc.edu
-
- In article <4278@wet.UUCP> ekrimen@wet.UUCP (Ed Krimen) writes:
- >Can someone explain what a heat sink does and how it works? I get the
- >impression that it provides a larger surface area to the chip so that it
- >can dissipate heat faster. I think I've seen what they look like too;
- >it looks kinda like a vent, with the tall ridges. But how does it work?
-
- Well, by providing a larger surface area (using very heat conductive
- materials) you allow more heat to be dissapated into the air - since more
- air molecules can contact the metal, more air molecules are able to absorb
- the heat energy, thus cooling the heat sink, and thus the chip.
-
- >It only looks like it's clamped onto the chip. And why is it that only,
- >at least from what I've heard, 80486 and 68040 chips need these?
-
- Usually, you only hear of the '486 and the '040 needing them because
- a) they have a larger number of transistors per package and thus generate more
- heat; b) they are the top of the line processors from each respective company
- and thus are usually the targets for the overzealus power freaks who want to
- run the chips faster than they are rated for.
-
- >--
- > ||| Ed Krimen
- > ||| ekrimen@wet.com
- > / | \ E.KRIMEN (GEnie)
-
- -Mike
-