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- Newsgroups: sci.materials
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- From: bart@netcom.com (Harry Bartholomew)
- Subject: Re: Microelectronic Fabrication
- Message-ID: <1m6mt9m.bart@netcom.com>
- Date: Fri, 14 Aug 92 11:20:23 GMT
- Organization: Netcom - Online Communication Services (408 241-9760 guest)
- References: <bob_erck-130892110757@msdmac59.msd.anl.gov>
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- The etching should leave no Boron residue, and the amount of Boron
- in the oxide would not be sufficient to form any acid otherwise all
- Boron doped device structures would be vulnerable.
-
- The phenomenon is well known in macro studies of fracture mechanics
- of glass and quartz, called "static fatigue" in that material tested
- immediately after fabrication is weakened by time, actually due to
- the stress-corrosion of the glass by water absorbed from the ambient.
- See Doremus's books and papers for details.
-