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- Newsgroups: sci.electronics
- Path: sparky!uunet!munnari.oz.au!metro!sunb!macadam!johnh
- From: johnh@macadam.mq.edu.au (John Haddy)
- Subject: Re: Beginners Question: RAS, CAS, and Refresh?
- Message-ID: <1992Aug19.032655.7494@mailhost.ocs.mq.edu.au>
- Sender: johnh@macadam (John Haddy)
- Nntp-Posting-Host: macadam.mpce.mq.edu.au
- Organization: Macquarie University, School of Mathematics, Physics, Computing and Electronics
- References: <etxansk.714131335@garbod20>
- Date: Wed, 19 Aug 1992 03:26:55 GMT
- Lines: 106
-
- In article <etxansk.714131335@garbod20>, etxansk@garbo.ericsson.se writes:
- |> I've been looking at chip descriptions for some common
- |> memory circuits.
- |>
- |> There are pins on them named RAS, CAS, and Refresh. I know
- |> it's basic knowledge, but I'm not sure where to find good
- |> documentation on this.
- |>
- |> The RAS and CAS signals are probably input signals to the
- |> chip used during addressing. I've assumed that they're used
- |> to tell the chip whether it's the most or least significant
- |> part of the address vector that's currently on the address
- |> bus. If I'm right about this, how come there are _two_
- |> addressing control signals?
- |>
- |> For the Refresh signal: I can't recall if this one really
- |> is a pin on the chip or if it's some event that's done with
- |> other signals. I've heard that certain types of chips need
- |> this signal in order to work properly. What is the CPU (or
- |> the main clock, or the addressing logic) supposed to do to
- |> give the memory chips the refresh?
- |>
- |> Anders Skelander
- |>
-
- For starters, the acronyms RAS and CAS stand for Row Address Strobe and Column
- Address Strobe, respectively. These signals, and the need to refresh, are
- peculiar to Dynamic RAM chips.
-
- You are correct in assuming that they are used for multiplexing the address bus.
- Internally, the DRAM operation involves a (slow) row select operation and a (much
- faster) column select in order to access a bit of data for reading or writing.
- The relative operation times for row and column select mean that it makes sense
- to give the DRAM chip a "head start" on the Row portion of the address. In
- addition, the multiplexing of the address allows for a smaller pin count and
- allows a higher density of chips when used in a system.
-
- Refresh is not usually a signal; it refers to an operation performed to maintain
- data integrity. The DRAM chip requires that each cell be rewritten at least once
- every n microseconds (n is chip dependent, but often 4 or 8 milliseconds for
- modern chips). Since most systems cannot guarantee that this will happen during
- the course of normal program execution, an explicit refresh cycle is usually
- performed. A refresh cycle may be performed either in a burst of distributed over
- time The choice is usually determined by whether system performance will suffer
- more from a short dead stop every (say) 4msec than from intermittent delays every
- 15usec. A refresh cycle consists of (usually sequentially) accessing each Word
- line in turn. Because a sense amplifier (the bit that determines whether a bit is
- a "one" or "zero") exists for each column, all the bits in one row may be
- refreshed at a time.
-
- Note that this feature, of all columns being activated at once by a word line, is
- used to enable high speed DRAM access. For sequential address location accesses,
- only one row address needs to be supplied, which causes the sense amplifiers on
- the Data Lines to access the capacitors holding the charge which indicates a
- logic "one" or "zero". Successive accesses then need only select _which_ one of
- the sense amplifiers to activate. Thus a multiple read cycle can run something
- like RAS, CAS, CAS, CAS, CAS (where RAS, CAS indicate the latching of a row or
- column address)
-
- If the system uses a DRAM controller chip, this can be programmed to
- automatically refresh the DRAM. Otherwise, the CPU would have to be interrupted
- by a timer once every 4 msec in order to service the DRAM refresh requirements.
-
- From the Hitachi DRAM Data Book:
-
- "The dynamic RAM memory cell consists of 1 MOS transistor and 1 capacitor, as
- shown in Figure 1. It detects the data in the cell (1 or 0) by the charge stored
- in the capacitor. Dynamic RAM offers a higher density than static RAM because it
- uses fewer components per chip."
-
- "However, dynamic RAM data must be rewritten (called refresh) in a defined cycle,
- because the charge stored in the capacitor leaks."
-
- Figure 1: Memory Cell of Dynamic RAM
-
- |
- -----|-------o------ Word Line
- | |
- | ===
- b______| |____
- | |
- | ---
- | ---
- | |
- | ___
- | ///
- Data Line
-
- ..."The multiplexed address inputs are latched as follows: RAS (row address
- strobe) selects one word line according to the row address signal, and one column
- decoder is selected by CAS (column address strobe) following a column address
- signal."
-
- Hope this helps. A good place to read up on memory technology is in the data
- books and application notes of the manufacturers themselves.
-
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