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- Newsgroups: comp.arch
- Path: sparky!uunet!decwrl!pa.dec.com!haddad
- From: haddad@pa.dec.com (Ramsey Haddad)
- Subject: Re: question on computer systems using Alpha ... (cooling)
- Message-ID: <1992Aug13.165230.26652@PA.dec.com>
- Sender: news@PA.dec.com (News)
- Organization: DEC Western Research Lab, Palo Alto, CA
- References: <DOCONNOR.92Aug11133018@potato.sedona.intel.com> <1992Aug12.121427.10251@dscomsf.desy.de> <713703530.11137@minster.york.ac.uk>
- Date: Thu, 13 Aug 92 16:52:30 GMT
- Lines: 27
-
- In article <713703530.11137@minster.york.ac.uk> martin@minster.york.ac.uk writes:
- >Why doesn't anyone (to my knowledge!) use heat pipes, and/or stirling engines
- >for cooling big chips like the alpha?
- >Both technologies can move vast amounts of heat, and have been around for many
- >years - certainly longer than there have been chips to cool!
-
- In "Packaging a 150W Bipolar ECL Microprocessor", William Hamburgen and
- John Fitch describe the use of a "thermosiphon" (which is "essentially a
- wickless heatpipe") for just such a purpose.
-
- It was presented at the "42nd Electronic Components and Technology
- Conference", San Diego, California, May 18-20, 1992. It is also available
- as Research Report 92/1 from the DEC Western Research Lab.
-
- To get a postscript version e-mailed to you, send electronic mail with the
- subject line containing the command "send postscript 92/1" to
- "WRL-Techreports@decwrl.dec.com".
-
- The photos in the report won't come out that way, so if you want a hard
- copy version, use the command "order 92/1" instead. Your mailing address
- needs to be somewhere in the header or body of the message.
-
- If you are having problems, use the "help" command.
-
- --
- Ramsey Haddad <haddad@decwrl.dec.com>
- speaking for myself.
-