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- Path: sparky!uunet!usc!rpi!uwm.edu!linac!att!cbnewsm!cbnewsl!att-out!rutgers!igor.rutgers.edu!planchet.rutgers.edu!nanotech
- From: nagle@netcom.com (John Nagle)
- Newsgroups: sci.nanotech
- Subject: Re: Progress on the Mechanical Side
- Message-ID: <Jan.21.22.50.27.1993.5161@planchet.rutgers.edu>
- Date: 22 Jan 93 03:50:28 GMT
- Sender: nanotech@planchet.rutgers.edu
- Organization: Netcom - Online Communication Services (408 241-9760 guest)
- Lines: 24
- Approved: nanotech@aramis.rutgers.edu
-
- rls@tip.wedge.nt.com (Robert L. Smith) writes:
- > I submit the following as an indication of progress toward
- >nanotech in one government agency -- a state government, at that! It
- >doesn't claim the nano scale -- although at least one of the listed
- >potential uses would require it -- and the estimated costs of $500 per
- >investor are worth a horse laugh. It's encouraging, even so. Use it
- >as you wish, but be aware that no copyright release has been obtained.
-
- This is reasonable enough. It's just a scheme for getting many
- projects onto a single wafer before running it through a wafer fab.
- This is a routine prototyping technique in IC development, and if you
- take an IC design class at a good school, your design may go to fab,
- along with that of many others, on a single wafer. Mead and Conway
- pioneered this approach to learning IC design.
-
- It actually makes good sense to get people doing this sort of
- work together. One sees pictures of gears and such made by IC fab
- techniques, but made by people who don't have an application for tiny
- gears. The technology has been looking for applications.
- Useful products may well come out of this effort.
-
- But it's not nanotechnology. Orders of magnitude bigger.
-
- John Nagle
-