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- From: ssivakum@ptdcs2.intel.com (Sam Sivakumar)
- Subject: Re: What's the deal? My chip says "SX-25"; Norton says "SX-33"
- Message-ID: <1993Jan6.213305.7650@ptdcs2.intel.com>
- Organization: Intel Corporation -- Aloha, Oregon
- References: <1993Jan5.151627.9623@bmers95.bnr.ca> <1993Jan5.184502.24931@ptdcs2.intel.com> <1993Jan6.142124.25566@bmers95.bnr.ca>
- Date: Wed, 6 Jan 1993 21:33:05 GMT
- Lines: 24
-
- In article <1993Jan6.142124.25566@bmers95.bnr.ca> khor@bnr.ca writes:
- >
- >There's a question I'd always wanted to ask. Why are wafers still made circular?
- >Since the dice are rectangular, wouldn't it save material growing the crystals
- >in a rectangular wafer?
- >
- The method for growing Si wafers is called the Czochralski process,
- commonly abbreviated as the CZ (pronounced see-zee) process. In this
- technique, a small seed crystal of a certain orientation is placed at the
- end of a mechanism that dips it into a melt of Si and the appropriate dopants
- and slowly raises it while turning it all the time. This produces a long
- cylindrical ingot of Si, which is then sliced into thin wafers, polished
- and sent to the epitaxial process. Here, a thin epitaxial layer, typically
- just a few microns thick is grown on the wafer by vapor phase epitaxy.
- This is the start material for a wafer production line. I would
- recommend the book "VLSI Technology" by Simon Sze. It explains the various
- steps in chip production, like epitaxy, diffusion, lithography, etch and
- thin film deposition very well, and is eminently readable.
-
-
- --
- Sam Sivakumar | Intel's very own lithography dude,
- ssivakum@ptdcs5.intel.com | Speakin' for himself, that's for sure!
- PTD, Aloha, OR |
-