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- Path: sparky!uunet!zaphod.mps.ohio-state.edu!rpi!newsserver.pixel.kodak.com!laidbak!tellab5!mcdchg!sol!sriram
- From: sriram@sol.UUCP (Mysore Sriram)
- Newsgroups: comp.lsi
- Subject: Wanted: Info Sources for Electronic Packaging/MCMs
- Message-ID: <1364@sol.UUCP>
- Date: 17 Jul 92 16:17:27 GMT
- Organization: Vista Technologies, Inc. Schaumburg, IL 60173 USA
- Lines: 22
-
-
- Subject: Wanted: Info sources for Electronic Packaging/MCMs
-
- I'm interested in establishing contact with people in academia and industry
- working in the packaging area, particularly in Multichip modules. I'm
- working towards my Ph.D., and my thesis is on MCM routing algorithms. I'm
- also working as a summer intern on a project involving package design, and
- the analysis of the various interacting parameters - electrical, thermal,
- mechanical, manufacturing, etc. - and tradeoffs involved in designing an
- electronic package.
-
- If any of you is working on similar problems, or knows of any good sources
- of up-to-date data on packaging techniques, materials, processes and CAD
- tools, I would appreciate hearing from you. I'll collate and summarize the
- responses I receive and post them on this net, for the benefit of other
- subscribers.
-
- M. Sriram
-
- msriram@logos.vlsi.uiuc.edu, sriram@vistatech.com
-
- (708) 706-9300 (Work phone)
-