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1987-06-02
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TELEDYNE MICROELECTRONICS
Leader in the Science of Microelectronics Packaging and Production
Want to determine how our products, services and capabilities can
support your design and production requirements? It's easy. There's no
need for complex inquiry forms. Simply provide us with what you have
already prepared: circuit schematics, weight and volume requirements
and, if you have them, a component list, screening and test
specifications. We'll evaluate your requirements and provide pricing
and delivery information. Your inquiry will be handled in strict
confidence. Our sensitivity to security, nondisclosure policies and our
ability to protect proprietary data is another feature of our services.
Whether your application is a new system, or you wish to improve an
existing product, contact us as early as possible in your development
schedule... the sooner, the better.
CUSTOM MICROELECTRONICS
o Memory Hybrids o Microprocessor Hybrids o Chip Carrier Assy.
o Medical Hybrids o Signal Conversion Hybrids o Modular Assemblies
o Display Modules o Gate Array Hybrids o High Power Hybrids
o Substrates o Fiber-Optic Hybrids o Severe Environments
o Subsystems o Analog/Digital Hybrids o High Frequency (MIC)
CUSTOM MICROCIRCUIT SUBSTRATE CAPABILITIES
PARAMETERS THICK FILM THIN FILM CO-FIRED
o Lines & Spaces (Minimum) 0.010" 0.001" 0.010"
Special 0.005"
o Multilayer 8-10 Layers In Development Yes
o Resistors N/A
Value Range 1-10 Megohms 1-200 K Ohms
Tolerance +/-0.5% +/-0.01%
Stability 2% 0.1%
Tracking Stability 25 ppm 2 ppm
Temperature Coefficient +/-100ppm/DegC +/-0 to 25ppm/DegC
Temp Coefficient Tracking 200ppm/DegC 10ppm/DegC
High Frequency Thru 10 GHz Thru 26 GHz
o Usages
Specialty Chips Yes Yes N/A
Ladder Networks Yes Yes N/A
Resistor Arrays Yes Yes N/A
Daughter Boards Yes Yes N/A
Hybrid Microcircuits Yes Yes Yes
Custom Electronic Modules Yes Yes Yes
SEM Modules (MIL-M-28787) Yes Yes Yes
o Technologies Noble & Deposition: Low or
Non-Noble Sputtering High
Alloys or Vacuum Temperature
Page 1
CUSTOM PACKAGING CAPABILITIES
Analog Bipolar and FET transistor circuits, linear IC's, ASIC's,
power supply PWM controllers, Signal Conversion, monitoring
and supervisory circuits, resistor ladder network arrays, etc.
Power Black-box-design or build-to-specification switching and
Supply linear power supplies, linear regulators, PWM Switch drivers,
power converters, etc.
High-Power Power bridges (FET or bipolar): Single or multiphase,
rectifier diode power packs, inverters, regulators,
intensifiers, converters, servoactuators, controllers,
sensors, pulse or positioning regulators and switches,
drivers, exciters, relays, etc.
Performance:
Power dissipation densities of 200 W/sq in
Thermal impedance of 0.5 Degrees C/W
Currents to 75 amps
400 W Maximum average power, 4 KW peak
Digital TTL, CMOS, ECL, PAL's, PLD's, semicustom and custom multi-chip
build-to-specification or black-box-design hybrids.
Memory Large static or dynamic RAM's, ROM's, EEPROM's, UVEPROM's,
Arrays etc.
Analog/ A to D, D to A converters, digital signal processing circuits,
Digital etc.
High 50 MHz through 26 GHz RF, Microwave and SAW hybrids in
Frequency standard, multicavity or connectorless grounded microstrip
(CGM tm) configurations.
Log amps, mixers, up converters, down converters, attenuators,
filters, transmitters, receivers, synthesizers, switches, etc.
Radar/Sonar output stages, RF/microwave transmitters and
receivers, signal processors and amplifiers.
Signal Coders, decoders and combinations.
Coding
Medical Ultra-low power hybrids for implantable life-sustaining,
therapeutic and diagnostic applications.
Displays Dot matrix and alphanumeric, monochrome, multi-color or full
color.
LED, LCD, EL and plasma technologies.
Flat panel information instrumentation, CRT replacement and
helmet mounted applications with integral modularized drive
and control circuitry and optical filters.
Page 2
Optical Fiber-optic links: transmitter-modulator/receiver-demodulator
pairs.
Focal plane diode arrays, integral address, control and drive
circuitry.
Laser data transmitters and receivers.
Data annotation and readout devices for photographic
applications, target designators, range finders and night
vision goggle applications.
Severe Specialized hermetic MIL-SPEC Class "B" or Class "S"
Environment packaging:
High-Temperature (250 Degrees C)
High-Shock (50,000 Gs)
High-Pressure (3,500 psi)
High-Radiation (10 MegRADs Si)
Radiation/ Black-box-design or build-to-print hardness critical packaging
Tempest/ for all levels of integration.
EMP
Hardened
Packaging
Modular For analog, digital, high-frequency, medical, power supplies,
Assemblies information display, optical-electronic and severe environment
and hardened applications.
Subsystems
Standard electronic module formats (MIL-M-28787)
Custom PCB, MATRIX, and chip carrier SMT packaging including
rigid-flex assemblies.
TELEDYNE MICROELECTRONICS
12964 Panama Street
Los Angeles, California 90066
(213)822-8229 - (213)870-9831
"Leader in the Science of Hybrid Packaging and Production"
Page 3