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OCR: KENWOOD ASB- 1055 Service Bulletin Amateur Radio Division Subject: Power Module Heat Sink Compound Date: March 28 1994 Symptom: Several current and past model transceivers do not use Heat Sink Compound on the power modules Our engineering department determined through testing, that those models with fine castings or machined areas under the power module do not really require its use Several service facilities and customers have questioned this anc are concerned that this could eventually cause failure of the power modules Corrective Action: In order to ameliorate any anxiety and to increase your confidence our engineers recommend that you use Silicone Heat Compound whenever replacing any of these devices or whenever they must be lifted for service of other components on the board. Our prod ...