a CAD-like thermal management software tool for electronic packaging engineers, ICEPAK uses Computational Fluid Dynamics (CFD) to analyze the combined effects of air flow and thermal distribution. ICEPAK helps engineers create new designs, test and refine untested designs, and update, revise, or improve old designs. Features include: library of standard objects (PCBs, fans, resistances, etc.), automatic optimized mesh generation, and extensive results viewing capability.
Madeline Burkhart
Dir., Mktg Communications
Fluid Dynamics International, Inc.
500 Davis Street
Suite 600
Evanston, IL 60201
USA
708-491-0200
708-869-6495 (fax)
burkhart@fdi.com
For applications in related solution areas, see the following indices: Design Optimization, Finite Element Modeling (FEM), Heat/Fluid/Electro-magnetic Flow, Mechanical Engineering, Package Design, the developer index for Fluid Dynamics International, Inc. and the market segment index for Computational Fluid Dynamics (CFD).
ICEPAK is a Trademark of Fluid Dynamics International, Inc.
