I-DEAS Electronic System Cooling software is designed to simulate 3D air flow and thermal behavior in electronic systems. It is an integrated part of I-DEAS Master Series sofrtware, which means modeling is performed directly with design geometry using a simple and intuitive graphical interface. With I-DEAS Electronic System Cooling, you can model individual components, multi-chip modules, heat sinks, PC boards as well as complete electronic systems. Unstructured free meshing and powerful mesh coupling technology allow you to simulate both system level and component detail in a single model. The software helps you to quickly perform a detailed thermal analysis and pinpoint design problems.
Kevin Duffy
Vice President
Maya Heat Transfer Technologies, Ltd.
4999 St. Catherine West
Suite 400
Montreal, PQ H3Z 1T3
Canada
514-369-5855
514-369-4200 (fax)
kevin@mayahtt.ca
For applications in related solution areas, see the following indices: Computational Fluid Dynamics (CFD), the developer index for Maya Heat Transfer Technologies, Ltd. and the market segment index for Mechanical Analysis.
I-DEAS Electronic System Cooling is a Trademark of Maya Heat Transfer Technologies,Ltd
