FEAP is an integrated application program for stress, advanced dynamic, fatigue life, 3D convective fluid flow, and thermal analyses of printed circuit boards (PCBs) and electronic systems. FEAP totally integrates the NISA family of programs to simultaneously perform any or all of these analyses for any PCB configuration including ones with cut-outs. This task is made easy by fully automated mesh generation and the pre- and post-processing capabilities that are an integral part of the program. FEAP has a large user-expandable, built-in library of commercially used component types. The program has convenient FORM based input, efficient file management, and task control through an interactive shell. Futhermore, a unique feature of FEAP allows the study of forced cooling effects on PCBs through a complete 3D convective fluid flow analysis.
Kant S. Kothawala, Ph.D.
President & CEO
Engineering Mechanics Research Corporation
1607 East Big Beaver Road
Suite 300
Troy, MI 48083
USA
810-689-0077
810-689-7479 (fax)
For applications in related solution areas, see the following indices: ECAE, Electrical Engineering Design, Finite Element Analysis (FEA), the developer index for Engineering Mechanics Research Corporation and the market segment index for EDA (Electronic Design Automation).
