Maxwell® SI Spicelink lets engineers evaluate high-speed circuit design issues involving electromagnetic and transmission line effects by evaluating physical performance of circuit structures at an IC, PCB, package, or system level. SI Spicelink computes an efficient equivalent circuit model for 2-D transmission lines and 3-D discontinuities that can be used in SPICE-based modeling of signal integrity, crosstalk, ground bounce, and propogation delay. SI Spicelink includes a Multi-layer Interconnect Modeler that automatically generates 3-D structures from multi-layer planar structures in DXF or GDSII format for the Maxwell 3-D solvers. Ansoft's Maxwell® electromagnetic finite-element technology provides a sophisticated yet easy-to-use field solver, including true 3D modeling. Links to other EDA systems available.
Jennifer McCoy
Sales Administrator
Ansoft Corporation
Four Station Square
Suite 660
Pittsburgh, PA 15219
USA
412-261-3200
412-471-9427 (fax)
info@ansoft.com
For applications in related solution areas, see the following indices: ECAE, Electrical Engineering Design, Engineering, Engineering Visualization, Package Design, Signal Integrity, the developer index for Ansoft Corporation and the market segment index for EDA (Electronic Design Automation).
Maxwell is a Registered Trademark of Ansoft Corporation
