HiQUAD Completes Family of Advanced Surface Mounting Power IC Packages

A new power package the same shape and size as the standard quad flat pack (QFP) completes SGS-THOMSON Microelectronics' family of high power surface mounting packages, which covers the whole range of applications from 10 to 64 leads.

Called HiQUADÖ-64 (JEDEC MO-188), the latest addition to the family is exactly the same size as a standard 14x14x2.8mm QFP package so it can be used with the same pick and place equipment, it can be stored in the same trays and it fits in the same sockets and handlers.

The new package joins other family members -- PowerSO-10 (JEDEC MO-184) and PowerSO-20 (JEDEC MO-166) -- conceived for the smart power chips of the future. Guiding the development of this family has been the philosophy that it was necessary to develop a completely new approach rather than attempting to enhance existing package designs.

Common design rules for the family include the adoption of a massive PbSn solder-coated copper slug for soldering to the substrate, ensuring very low thermal resistance and high thermal capacity. They also have a PbSn die attach with a high melting temperature (above 300) to suit the needs of circuits designed to operate at high temperatures -- a feature very useful in industrial and automotive applications.

Other common features are designed to simplify soldering. All of the new package types are symmetrical so that the package aligns itself during reflow soldering. Moreover, the copper slug is exposed in two points so that the solder joint between slug and substrate can be inspected.

The new packages have a junction-case thermal resistance better than 1 K/W, a 10mils thick copper leadframe and a choice of gold or aluminum bonding wires. Die sizes up to 120Kmils2 can be accommodated.

To cover the widest possible range of pin counts without proliferating footprints, SGS-THOMSON package engineers have adopted the variable lead pitch concept from QFP packages. Four pitches are planned: 1.27mm, 1mm, 0.8mm and 0.65mm, so that the basic PowerSO-10 design can give 10, 12, 16 and 20 pin packages, the PowerSO-20 package can give 20, 24, 30 and 36-pin types, while the larger HiQUAD type can give 32, 42, 52 and 64-pin types. To suit very large chips with few pins a special version of the HiQUAD package with leads on just two sides has also been designed. Called Power-SO-20W, this package can be shipped in tubes, rather than the more expensive trays.

SGS-THOMSON's PowerSO-10, PowerSO-20 and HiQUAD-64 packages have been registered with the Joint Electronic Device Engineering Council (JEDEC).

Surface mounting power packages with low thermal resistance, high pin counts and large die size are needed for the new generation of super smart integrated circuits now reaching the market. These circuits are made possible by the development of new technologies like SGS-THOMSON's BCD3, which combines bipolar, CMOS and DMOS in a single 1.2um 60V process that can integrate power elements, microprocessor cores and non-volatile memory on a single chip.

PowerSO and HiQUAD are trademarks of SGS-THOMSON Microelectronics.

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