++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++ ASME ELECTRICAL and ELECTRONIC PACKAGING DIVISION NEWSLETTER: ________________________________________________________________ Editor: Tim Bennett --SUMMER 1989 ________________________________________________________________ ******************* *** Chairmans Remarks *** ******************* What can a division chairman write that is profound enough to be worth a busy engineers time? Speaking only from my own, very limited experience, perhaps the answer is - - "not much". What I would like to say to you if we were talking over a cup of coffee is just 5 things. First, I want you to know that the Electrical and Electronic Packaging Division (EEPD) is a young division with an exciting future and lots of opportunities for an individual. Opportunities for professional growth, opportunities for involvement at the national and local levels, and numerous opportunities for leadership. Do any of these opportunities interest you? If so, contact us. Second, I'd want you to know that the purpose of the EEPD is to aid and enhance the individual packaging engineer - YOU! The problem always distills to that critical question - How? If you have some ideas - terrific! We're looking for ideas! Again, contact us. Third, do you know about local chapters? A local technical chapter is a subgroup of the local section but at the same time has connections to a technical division (in this case EEPD). Are there benefits for you in such a subgroup? If so, why not participate in or initiate an EEPD chapter in your section. Fourth, often the mechanical engineer in an electronic world feels like an under appreciated professional. If you know what I mean, perhaps it's to your advantage to actively join those of like mind. There is a growing awareness that packaging considerations (or mechanical aspects, or physical design, or whatever words are used at your place) are becoming increasingly critical to both performance and costs. A technical organization that focuses on, defines, discusses, and coordinates these forces seems appropriate for the future. Fifth, while we are a part of the ASME, electronic packaging by its very nature is multidisciplinary. The members of the EEPD executive committee have used their limited time and funds since the founding of this division to get the division functioning. It is now time to reach out and work more closely with other professional groups who have goals similar to ours. If you are involved with another group, or feel we should cooperate better with another group - please, again, let us know. I was right - this isn't profound. But I do hope it has been worth your time. I'm just an engineer working in an electronic industry who happens, this year, to be the division chair. It is clear to me that the vitality and impact of this division rests not so much with a half dozen or so committee members, or with the dynamic group of Journal Editors, or even the attendees at our technical sessions, but with the participation, involvement, and support of the EEP division members! That's you!! Get involved, give me a call (312/416-5188)! Or, write to me (AT&T Bell Labs, Rm 1F-120, 200 Park Plaza, Naperville, IL. 60566)! Or, send me a FAX (312/416-4904)! Or, contact any of the other members of our executive committee. Now would be a good time, while you are thinking of it. -Don White ---------------------------------------------------------------- ********************** *** BOOKS ON THE HORIZON *** ********************** PACKAGING OF ELECTRONIC SYSTEMS A MECHANICAL ENGINEERING APPROACH --------------------------------- by James W. Dally Mechanical Engineering Department University of Maryland, College Park, MD A new book entitled PACKAGING OF ELECTRONIC SYSTEMS -- A MECHANICAL ENGINEERING APPROACH is currently in the final phase of publication. This book has been written for engineers to serve as a first text on the packaging of electronic systems. The material is suitable for senior or graduate level engineering students or for practicing professionals working as mechanical or electrical engineers with firms producing electronic instruments or systems. The book, an introduction to packaging electronic systems, covers a very broad range of topics from the physics of semiconductors to the design of advanced high performance heat exchangers. To accommodate this breadth, the text is divided into three independent parts. Part I, which includes three chapters, deals with foundations for design. Chapter 1 is descriptive of the entire field covering in some detail the mechanical design issues which arise in developing electronic systems. Also, covered are business aspects of this industry particularly as they are related to a rapidly changing technology which leads to early obsolescence of an existing product line and exacting requirements for investing in new product development. Chapter 2 describes electronic components with emphasis on semiconductor devices. Importance is placed on silicon technology and the continuous development of logic and memory circuits with higher levels of integration. We try to show in this chapter the dynamics of the technology and the emerging technological problems associated with the introduction of VLSI. The most important problems include handling high I/O counts and dissipating very large heat flux with exceedingly small temperature differences. Chapter 3 covers circuit analysis. The conventional methods of analysis of ordinary ac and dc circuits are briefly reviewed. However, the emphasis is placed on transmission lines where the inductance, resistance and capacitance is distributed. This development is new to most mechanical engineers, and it is critical to their understanding of propagation delay, line charging and pulse reflections which must be taken into account in the design of even moderate performance systems. Part II deals with the three basic levels of packaging electronic components. The chip carrier, the first level package, is treated in detail in Chapter 4. Both pin-in-hole and surface mounted chip carriers are covered. The printed circuit board, the second level package, is described in Chapter 5. The treatment is often descriptive in nature, providing an opportunity to introduce the terminology used in the industry to denote circuit board features. Some of the very difficult problems associated with component placement and trace routing are introduced in this chapter with simple examples. The manufacturing process associated with production of circuit boards is described in Chapter 6. The final chapter in Part II which covers third level packaging describes many components encountered when a number of printed circuit boards is enclosed in instrument cases or cabinets. Connectors, back panels, cabling and both commercial and military enclosures are treated in some detail. Analysis methods commonly employed to predict performance of systems are covered in Part III. Chapter 8 deals with heat transfer by conduction. Basic conduction equations are reviewed and applications to problems arising in conducting the heat generated on a chip to the heat sink are given. Heat transfer by radiation and convection are treated in Chapter 9. The final chapter covers vibration of components and circuit boards. Here the emphasis is on simple analytical procedures which give insight on methods to reduce transmissibility coefficients and if possible to avoid resonance conditions. Failure by fatigue is recognized as a major problem in systems exposed to vibration and methods of fatigue analysis fragility charts are described for electronic components. The book does differ to some degree from the conventional design text book commonly found in Mechanical Engineering. We have attempted to introduce business aspects of design. Of particular importance here is the fact that the market price of a product drives the design. Some of the thought process associated with product development is covered by describing design and manufacturing aspects (good and bad) in the narrative parts of the text. Exercises are given at the end of each chapter and many of them are markedly different than those found in the usual engineering text book. They require the student to do much more than plug and chug. The student will sketch, prepare graphs describing solution space, conceive new designs better than existing designs, write engineering briefs, interpret solutions and draw conclusions related to design merits, and make judgments based on business aspects. The book is to be published by McGraw Hill Publishing Company and should be available in early 1990. ---------------------------------------------------------------- ********************************** *** HEY BUDDY, CAN YOU SPARE A DOLLAR? *** ********************************** The EEPD requests that each division member consider donating one dollar ($1.00) or five, or even ten dollars to our treasury. If each member donated at least $1.00 a year, EEPD could greatly increase its activities for the division membership, e.g. additional newsletters, engineering resource material, etc. Make checks payable to "ASME-EEPD" and mail to Fred Goldfarb, ASME, 345 East 47th Street, New York, NY 10017. Thank you so much for your contribution. Yes, I will contribute $ _______ to EEPD MAIL TO: Fred Goldfarb ASME 345 East 47th Street New York, NY 10017 NAME: ___________________________________________________ FIRM ORGANIZATION: ______________________________________ ADDRESS: ________________________________________________ CITY: _____________________ STATE: ______ ZIP CODE ______ COUNTRY:_________________________ ---------------------------------------------------------------- ***************** *** FROM THE EDITOR *** ***************** To rephrase the Chairman's opening statement, what can the EEPD newsletter editor publish that is important enough to be worth a busy engineers time? The answer to this question should come from you the reader and doer. EEPD division and newsletter is and for the division members and those interested in packaging. To keep the division growing and the newsletter interesting, we need submittances from you. Possible topics of articles for the newsletter are: * call for papers * upcoming conferences, events, courses * past conferences, events, courses * what your university or company is doing in packaging * what your university has to offer in packaging * new literature and software * who is moving up or out * personal awards * obituaries * cartoons * general points of interest -- Or anything else you feel would be of interest to the other readers on a local, national, or international level. In addition to text, we are able to print photos, charts, graphs, and drawings to accompany your article. If you have a photograph of yourself, or graphics and/or photographs pertaining to your article, please submit it with your article. Because this is a members newsletter ASME, EEPD, and the editor do not necessarily endorse, recommend, or concur with the articles printed. It is up to the reader to determine if the information in the article is for them. We are allowed to publish one newsletter per year using ASME newsletter funds. To print more often, preferably twice per year, we need help from the EEPD members in terms of donations and articles. We will be publishing another newsletter in October of this year using the 1990 funds, if you have an article you would like printed, please submit it to me by the last week in August. To close, I hope you have found something of interest in the newsletter. I am always open for comments and suggestions to improve the paper. For information or suggestions on the EEPD newsletter contact: Tim Bennett E-Systems, Melpar Div. 11225 Waples Mill Road Fairfax, Virginia 22030 703-385-5880 ext. 1896 ---------------------------------------------------------------- *********************************** *** THE JOURNAL OF ELECTRONIC PACKAGING *** *********************************** The first issue of the ASME Transaction Journal appeared in March 1989.Its goal is to treat, on a high level, the practical problems facing engineers, scientists, and researchers in an explosive new field. Major subjects for journal articles include micromechanics and stress analysis, heat transfer and fluid flow management, physical design and architecture, failure prevention, surface solder, dynamics, materials and processing, manufacturing, computer methods, electrical contacts. The Journal is also intended to be a seminal body for organizing conference symposia, publishing discussions, news items, book reports, and to serve as a lively source of information. The Technical Editor is Peter A. Engel, Professor of Mechanical Engineering at SUNY Binghamton (formerly of the IBM Endicott Laboratory). Articles submitted to the Journal are reviewed by recognized experts in the field. The Editorial Board invites contributions from the wide engineering/ scientific community, and will strive to facilitate a rapid turn-around time. ---------------------------------------------------------------- **************** *** EEPD and MI 90 ** **************** Tentative plans are underway for EEPD to sponsor a session at Manufacturing International 90 in Atlanta, Georgia, March 25-28, 1990. Dr. Abhijit Chandra, of the University of Arizona, is the EEPD manufacturing liaison and will be chairing this session. Anyone wishing to present a paper or give a talk should send a abstract ASAP to Dr. Chandra at the address listed below. Also, volunteers are needed to review papers and serve on his committee. Dr. Abhijit Chandra Aerospace and Mechanical Engineering University of Arizona Tuscon, AZ 85721 (602) 621-2080 ---------------------------------------------------------------- ************************ *** ELECTRONIC PACKAGING *** *** AT THE *** *** UNIVERSITY OF MARYLAND *** ************************ The University of Maryland, with support from the National Science Foundation, has established a University/Industry Center of Research called Computer Aided Life Cycle Engineering (CALCE) for electronic design. The focus of the CALCE Center research is on the design of first, second, and third level electronic packages from an integrated life cycle engineering viewpoint, in which reliability, producibility, maintainability, and cost are considered in addition to performance. For example, issues such as thermal management, stress-strain control, moisture ingress, and corrosion are integrated into the design process as inputs to reliability prediction models which in turn input to maintainability prediction models which in turn input to maintainability prediction models. Research is being conducted on such packaging issues such as hermeticity, die bonding, wire bonding, lead and lid sealing, component mounting, component placement. thin via fatigue, connector stresses, etc., but the emphasis is on improving the package as a multi-objective problem. Presently, the CALCE Center is supported by the Navy at China Lake, Control Data Corporation, General Dynamics, GTE, Northrop, Texas Instruments, and Westinghouse Defense Electronics. The CALCE Center employs twelve faculty members from a variety of departments, ten full time staff members, and over fifteen graduate students. Dr. Michael Pecht is the Director of the CALCE Center, is an associate professor with a joint appointment in the Departments of Mechanical Engineering and Systems Research at the University of Maryland, and is also the editor to the IEEE Transactions on Reliability. For additional information contact: Dr. Michael Pecht The University of Maryland College Park Campus Mechanical Engineering College of Engineering College Park, Maryland 20742 ---------------------------------------------------------------- **************** *** RESEARCH NEEDS *** **************** The EEPD is in process of establishing a working committee on research. One objective of the committee is to identify research needs in the area of electronics physical design, i.e. areas of technology where there are voids in information. Another objective involves the initiation of action to address such needs using the resources available through ASME, and by coordination with outside groups such as foundations, institutes or other technical societies. You are invited to contribute ideas and suggestions which identify research topics, or which may lead to the identification of research needs. You are also invited to participate as a member of the EEPD Research Committee should you have an interest in research and the identification of research needs. Please submit your suggestions, statement of interest and requests for further information to: Warren C. Fackler, P.E. Telesis Systems, Inc. P.O. Box 219 Ceder Rapids, Iowa 52406 (319) 363-2675 ---------------------------------------------------------------- ******************************************** *** ELECTRICAL & ELECTRONIC PACKAGING DIVISION *** *** (founded in 1983) *** *** 1988-1989 *** ******************************************** _____________________ Executive Committee 1988-1989 _____________________ Chairman: Donald H. White,PhD,PE AT&T Bell Laboratories Indian Hill Park 200 Park Plaza, Room IF 120 Naperville, IL 60566 312-416-5188 Secretary-Treasurer: Christopher G. Morosas Digital Equipment Corp. MS LKG 1-2/H17 550 King Street Littleton, MA 01460-1289 508-486-7922 Program Chairman: Anthony J. Rafanelli,PE Raytheon Company Submarine Signal Division 1847 West Main Road Portsmouth, RI 02871 401-847-8000 Ext. 4850 Senior Editor, EEPD Journal: Peter Engel,PhD,PE Dept. of Mech. Engr. SUNY Binghamton Binghamton, NY 13901 607-777-6216 Members: Sevgin Oktay IBM Corporation P.O. Box 950 E61-996-1 Poughkeepsie, NY 12602 914-432-1756 Allan D. Kraus,PhD 49 Country Club Gate Pacific Grove, CA 93950 408-646-2730/649-8276 Jay S. Abramowitz,PhD UNISYS 322 N. 2200 West Salt Lake City, UT 84116 801-594-6287 Past Chairman: Warren C. Fackler Telesis Systems, Inc. P.O. Box 219 Cedar Rapids, IA 52406 319-363-2675 _____________________ STANDING COMMITTEES _____________________ Membership and Chapters: Walker B. Kelly Rockwell International Collins Government Avionics Division 400 Collings Road, NE Cedar Rapids, Iowa 52498 319-395-5418 Protective Packaging: Sergei G. Guins Kaser Associates, Inc. 4496 Dobie Road Okemos, MI 48864 517-349-0587 Education Task Force: Bharat S. Thakkar,PhD AT&T Bell Laboratories Room 1H,8B-205 Naperville, IL 60566 312-979-3790 Research Task Force: Warren C. Fackler,PE Telesis Systems, Inc. P.O. Box 219 Cedar Rapids, IA 52406 319-363-2675 Newsletter Editor: Timothy J. Bennett E-Systems, Melpar Div. 11225 Waples Mill Road Fairfax, Virginia 22030 703-385-5880 ---------------------------------------------------------------- ********************************* *** EEPD ENJOYS SUCCESS AT 1988 WAM *** ********************************* The Electrical and Electronic Packaging Division (EEPD) enjoyed a successful turnout at the 1988 Winter Annual Meeting (WAM) this past November in Chicago. EEPD sponsored seven technical sessions dealing with failure analysis, stress analysis, heat transfer/ thermal management, distribution environments, vibration, and surface mount reliability. EEPD received excellent feedback on the quality of the program. The executive Board would like to thank all session chairpersons, vice chairpersons, authors, and panelists for their efforts which led to a successful meeting. ________________________________________________________________